公开(公告)号：US20190236990A1

公开(公告)日：2019-08-01

申请号：US16332304

申请日：2017-09-12

Applicant: Samsung Electronics Co., Ltd. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Jae-Yeon SONG ,  Sung-Jea KO ,  Eric YIP ,  Byeong-Doo CHOI ,  Sung-Ho LEE ,  Sung-Tae KIM

IPC: G09G3/00 ,  G06T3/00 ,  G06T7/11 ,  G06T15/20

CPC classification number: G09G3/001 ,  G06T3/0043 ,  G06T3/0062 ,  G06T7/11 ,  G06T15/20 ,  G06T19/00 ,  G06T2207/10016 ,  G09F19/18

Abstract: The present invention relates to a technology for a sensor network, machine to machine (M2M) communication, machine type communication (MTC), and the Internet of things (IoT). The present invention can be utilized for intelligent services (smart home, smart building, smart city, smart car or connected car, health care, digital education, retail, security and safety-related services, and the like) based on the technology. The present invention relates to an efficient image processing method and device for virtual reality content, and according to one embodiment of the present invention, the image processing method for projecting an image of virtual reality content comprises the steps of: acquiring a first planar image projected by dividing a front part and a rear part of a spherical image for expressing a 360-degree image; generating a second planar image projected by sampling the first planar image on the basis of a pixel position; and encoding the second planar image.

公开(公告)号：US20180294598A1

公开(公告)日：2018-10-11

申请号：US15946825

申请日：2018-04-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Ho LEE

IPC: H01R13/52 ,  G06F1/16

CPC classification number: H01R13/521 ,  G06F1/1656 ,  H01R13/5202 ,  H01R13/5213 ,  H01R13/5219

Abstract: A connecting component with a waterproof device according to one embodiment may include: a case having an insertion hole into which an external device is inserted; and the waterproof device may include: a body portion disposed to surround a peripheral portion of the insertion hole; and a protrusion extending from the body portion and protruding in a direction parallel to an insertion direction of the external device. Other embodiments are also possible.

公开(公告)号：US20150270330A1

公开(公告)日：2015-09-24

申请号：US14732260

申请日：2015-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Ho LEE ,  Jin CHOI ,  Yong-Ho YOO ,  Jong-Hyuk KANG ,  Hyun-Joo CHA ,  Hee-Dong PARK ,  Tae-Jung PARK

IPC: H01L49/02

CPC classification number: H01L28/91 ,  H01L27/10817 ,  H01L27/10852 ,  H01L28/60

Abstract: A semiconductor device includes a plurality of lower electrodes on a substrate, with each of the lower electrodes extending in a height direction from the substrate and including sidewalls, the lower electrodes being spaced apart from each other in a first direction and in a second direction, a plurality of first supporting layer patterns contacting the sidewalls of the lower electrodes, the first supporting layer patterns extending in the first direction between ones of the lower electrodes adjacent in the second direction, a plurality of second supporting layer patterns contacting the sidewalls of the lower electrodes, the second supporting layer pattern extending in the second direction between ones of the lower electrodes adjacent in the first direction, the plurality of second supporting layer patterns being spaced apart from the plurality of first supporting layer patterns in the height direction.

Abstract translation: 半导体器件包括在基片上的多个下电极，其中每个下电极从衬底沿高度方向延伸并且包括侧壁，下电极在第一方向和第二方向彼此间隔开， 与下电极的侧壁接触的多个第一支撑层图案，第一支撑层图案沿着第一方向在第二方向上相邻的下电极之间延伸;多个第二支撑层图案，其与下部电极的侧壁接触; 电极，所述第二支撑层图案沿着所述第二方向在与所述第一方向相邻的所述下电极中的所述第二方向延伸，所述多个第二支撑层图案在所述高度方向上与所述多个第一支撑层图案间隔开。