公开(公告)号：US10085084B2

公开(公告)日：2018-09-25

申请号：US15412410

申请日：2017-01-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonmi Kim ,  Sunghan Park ,  Myoungsung Sim ,  Sangju Lee ,  Juhee Chang ,  Hwangyun Cho ,  Janghoon Kang ,  Myungcheol Lee ,  Ho-Chul Hwang

IPC: H04R25/00 ,  H04R1/10

CPC classification number: H04R1/1066 ,  H04R1/1016 ,  H04R1/1058 ,  H04R1/1083

Abstract: The present disclosure discloses a wearable device with a sound sealing structure. The disclosed device may include a housing having at least one or more sound holes, at least one or more substrates fixed inside the housing, and at least one or more sound element portions disposed in the housing to face a 1st direction(+) and including a sound path comprising a duct structure for connection to the sound hole. At least one or more coupling structures on which a coupling force is exerted in a 2nd direction facing a vertical direction of the 1st direction may be formed between the housing and the sound element portion, and the sound element portion may be prevented from and/or resist being moved back in a 1st direction(−) due to the at least one or more coupling structures.