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公开(公告)号：US09774939B2
公开(公告)日：2017-09-26
申请号：US15161754
申请日：2016-05-23
发明人： Min-Young Park , Kwangmin Kil , Jae-Joon Yoo , Chang-Youl Lee , Janghoon Kang , Taeeon Kim , Youngbae Park
CPC分类号： H04R1/028 , H04M1/03 , H04R1/023 , H04R1/025 , H04R2499/11
摘要： A slim electronic device is provided. The slim electronic device includes a substrate having an opening formed therein, and an audio component accommodated in the opening of the substrate without overlapping the substrate and disposed such that the top and bottom thereof are substantially parallel to the top and bottom of the substrate.
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公开(公告)号：US11218582B2
公开(公告)日：2022-01-04
申请号：US16484683
申请日：2018-01-31
发明人： Hochul Hwang , Janghoon Kang , Youngbae Park , Hanbom Park , Byounguk Yoon , Kyunghee Lee , Joonrae Cho
摘要： An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate, a second plate, and a side member surrounding the space between the first plate and the second plate; a processor arranged in the space; a display exposed through a part of the first plate; a communication circuit arranged in the space; a piezoelectric actuator arranged in the space and providing vibration to the first plate; a speaker arranged in the space near the edge of the first plate; an audio processing circuit arranged in the space and electrically connected to the piezoelectric actuator and the speaker; and a memory arranged in the space and electrically connected to the processor. According to various embodiments, when instructions, which can be included by the memory, are executed, the processor wirelessly connects to an external device by using the communication circuit, receives an audio signal through the communication circuit, and provides the audio signal to the audio processing circuit. According to various embodiments, the side member can be separated from or integrated with the second plate. According to various embodiments, the audio processing circuit can provide, to the piezoelectric actuator, a first signal having a first frequency band and can provide, to the speaker, a second frequency band lower than the first frequency band, on the basis of at least a part of the audio signal. Additional various embodiments are possible.
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公开(公告)号：US10356498B2
公开(公告)日：2019-07-16
申请号：US15423808
申请日：2017-02-03
发明人： Changshik Yoon , Sunyoung Lee , Byounghee Lee , Janghoon Kang , Hochul Hwang
摘要： The present disclosure relates to an electronic device having a side acoustic emission speaker. The electronic device may include a speaker module accommodated in the electronic device. The speaker module may include a first substrate, a speaker having a lower surface formed on the first substrate, a waterproof member contacting at least one part of an upper surface and at least one part of a first side surface of the speaker, and a second substrate contacting a second side surface of the speaker and overlapping the upper surface of the speaker. The second substrate may include a first subarea displaced from the upper surface of the speaker by a first distance and having a first thickness and a second subarea displaced from the upper surface of the speaker by a second distance and having a second thickness. A space disposed between the waterproof member and the first subarea may include an acoustic emission hole configured to transfer a sound emitted by the speaker to the outside of the electronic device.
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公开(公告)号：US10085084B2
公开(公告)日：2018-09-25
申请号：US15412410
申请日：2017-01-23
发明人： Seonmi Kim , Sunghan Park , Myoungsung Sim , Sangju Lee , Juhee Chang , Hwangyun Cho , Janghoon Kang , Myungcheol Lee , Ho-Chul Hwang
CPC分类号： H04R1/1066 , H04R1/1016 , H04R1/1058 , H04R1/1083
摘要： The present disclosure discloses a wearable device with a sound sealing structure. The disclosed device may include a housing having at least one or more sound holes, at least one or more substrates fixed inside the housing, and at least one or more sound element portions disposed in the housing to face a 1st direction(+) and including a sound path comprising a duct structure for connection to the sound hole. At least one or more coupling structures on which a coupling force is exerted in a 2nd direction facing a vertical direction of the 1st direction may be formed between the housing and the sound element portion, and the sound element portion may be prevented from and/or resist being moved back in a 1st direction(−) due to the at least one or more coupling structures.
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