公开(公告)号：US20230023401A1

公开(公告)日：2023-01-26

申请号：US17958694

申请日：2022-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoondo HEO ,  Minuk KIM ,  Kyungtae NAM ,  Valeriy PRUSHINSKIY ,  Sanggon SHIN ,  Sunmyung LEE ,  Suk HYUN

IPC: G01L1/22 ,  G06F3/044

Abstract: An electronic device includes a cover window defining a front surface of the electronic device; a first sensor provided under the cover window and configured to detect a pressure applied to the cover window; a second sensor provided on a same layer as the first sensor and configured to detect the pressure applied to the cover window; a first adhesive member provided on at least one area under the second sensor, wherein the second sensor is less deformed than the first sensor by the pressure applied to the cover window provided by the first adhesive member; and a processor configured to: acquire a first pressure change amount detected by the first sensor and a second pressure change amount detected by the second sensor; and detect the pressure applied to the cover window based on the first pressure change amount and the second pressure change amount.