公开(公告)号：US20250014825A1

公开(公告)日：2025-01-09

申请号：US18676986

申请日：2024-05-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunwoo Han

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/18

Abstract: Provided is a capacitor including a ceramic main body, an internal electrode inside the ceramic main body, and a plurality of external electrodes respectively on a first surface and a second surface that are opposite to each other in a horizontal direction of the ceramic main body. Each of the plurality of external electrodes includes one or more prevention portions protruding in an outward direction of the ceramic main body or recessed in an inward direction of the ceramic main body.

公开(公告)号：US12046546B2

公开(公告)日：2024-07-23

申请号：US17568345

申请日：2022-01-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shlege Lee ,  Dongok Kwak ,  Sunwoo Han

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/18 ,  H01L2224/16227

Abstract: A package substrate includes; a conductive line extending in a first horizontal direction, a conductive pad on an upper surface of the package substrate and horizontally spaced apart from the conductive line in a second horizontal direction, and a protective layer covering the conductive line and including an opening selectively exposing a portion of the conductive pad. The opening has an elongated elliptical shape having a minor axis defined by a width extending in the first horizontal direction and a major axis defined by a length extending in the second horizontal direction.