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公开(公告)号:US20170170239A1
公开(公告)日:2017-06-15
申请号:US15377424
申请日:2016-12-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Tae-yon LEE , Kyoung-won NA , Jung-chak AHN , Myung-won LEE , Joo-yeong GONG
CPC classification number: H01L27/307 , H01L27/14603 , H01L27/14614 , H01L27/14621 , H01L27/14641 , H01L27/14645 , H01L27/14665 , H01L27/14689 , H01L51/441 , H01L51/447 , Y02E10/549
Abstract: An image sensor includes a substrate comprising a first face and a second surface which faces the first surface and on which light is incident, a semiconductor photoelectric conversion device on the substrate, a gate electrode located between the first surface of the substrate and the semiconductor photoelectric conversion device and extending in a first direction perpendicular to the first surface, and an organic photoelectric conversion device stacked on the second surface of the substrate.
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公开(公告)号:US20180331159A1
公开(公告)日:2018-11-15
申请号:US15783000
申请日:2017-10-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gwi-deok Ryan LEE , Kwang-min LEE , Tae-yon LEE , Masaru ISHII
CPC classification number: H01L27/307 , H01L51/442
Abstract: Provided is an image sensor including an organic photoelectric layer capable of enhancing color reproduction. An image sensor includes a semiconductor substrate including a plurality of pixel regions spaced apart from each other and an isolation region therebetween. Each of the plurality of pixel regions has a unit pixel. The image sensor also includes a device isolation layer in the isolation region and surrounding the unit pixel, a first transparent electrode layer, an organic photoelectric layer, and a second transparent electrode layer. The image sensor further includes a via plug electrically connected to the first transparent electrode layer, and arranged between the device isolation layers in the isolation region. The via plug passes through the isolation region. The first transparent electrode layer, the organic photoelectric layer and the second transparent electrode layer are sequentially arranged over the semiconductor substrate.
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