公开(公告)号：US20230054995A1

公开(公告)日：2023-02-23

申请号：US17982229

申请日：2022-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun HA ,  Jaehoo PARK

IPC: H01L33/54 ,  B29C45/14 ,  B29C45/16 ,  H01L25/075

Abstract: A display module is provided that includes a substrate and a molding part. The substrate includes a first surface disposed with a plurality of LEDs, and a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body. The molding part covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.

公开(公告)号：US20210282262A1

公开(公告)日：2021-09-09

申请号：US17319633

申请日：2021-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun HA ,  Taeje PARK

IPC: H05K1/02 ,  H01L23/00 ,  H01L21/02

Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

公开(公告)号：US20190387620A1

公开(公告)日：2019-12-19

申请号：US16439207

申请日：2019-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun HA ,  Taeje Park

IPC: H05K1/02 ,  H01L21/02 ,  H01L23/00

Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.