公开(公告)号：US20240222273A1

公开(公告)日：2024-07-04

申请号：US18461040

申请日：2023-09-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUN SOO CHUNG ,  DAE-WOO KIM ,  WON-YOUNG KIM

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L23/528 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/13 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2224/13

Abstract: A semiconductor package is provided. The semiconductor package comprises a first semiconductor chip including the first signal wiring structure disposed in an upper surface thereof, and a first power wiring structure disposed in a lower surface thereof, a second semiconductor chip disposed on the first signal wiring structure and including a second signal wiring structure, a second power wiring structure disposed on the second semiconductor chip and a first power connection pillar connecting the first power wiring structure and the second power wiring structure to each other.

公开(公告)号：US20250054913A1

公开(公告)日：2025-02-13

申请号：US18581483

申请日：2024-02-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNSOO CHUNG ,  KWANG-SOO KIM ,  WON-YOUNG KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device includes first to third semiconductor chips consecutively stacked. The first semiconductor chip comprises a first semiconductor substrate. A circuit layer is on a top surface of the first semiconductor substrate. First pads are on a top surface of the circuit layer. The first pads are electrically connected to the circuit layer. The second semiconductor chip comprises a second semiconductor substrate. Passive devices are in the second semiconductor substrate. Second pads are on a bottom surface of the second semiconductor substrate. The second pads are electrically connected to the passive devices. Third pads are on a top surface of the second semiconductor substrate. The third semiconductor chip comprises fourth pads on a bottom surface of the third semiconductor chip. The first pads and the second pads are directly connected to each other. The third pads and the fourth pads are directly connected to each other.