公开(公告)号：US20240230528A1

公开(公告)日：2024-07-11

申请号：US18389028

申请日：2023-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunhong Jun ,  Inkeun Baek ,  Wontae Kim ,  Namil Koo ,  Ingi Kim ,  Sungyoon Ryu ,  Younghoon Sohn ,  Yusin Yang ,  Ikseon Jeon ,  Eunhyuk Choi

IPC: G01N21/3581 ,  G01N21/95 ,  H01L21/66

CPC classification number: G01N21/3581 ,  G01N21/9501 ,  H01L22/12

Abstract: A measuring apparatus includes a stage including a transmissive wafer chuck on which a sample wafer is provided, where the sample wafer includes a silicon substrate and at least one material layer on the silicon substrate, a light source unit including a light source configured to generate and output a femtosecond laser beam, and a confocal laser-induced terahertz (THz) emission microscopy (LTEM) unit configured to generate multi-photon excitation by splitting the femtosecond laser beam into four sub-laser beams and causing three sub-laser beams among the four sub-laser beams to be incident in an overlapping manner on a measurement position of the sample wafer, where the confocal LTEM unit is configured to generate the multi-photon excitation based on the three sub-laser beams being incident on a lower surface of the silicon substrate.