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公开(公告)号：US20240019362A1
公开(公告)日：2024-01-18
申请号：US18220672
申请日：2023-07-11
发明人： Junbum Park , Namil Koo , Jaeho Kim , Jongsu Kim , Suhwan Park , Sangwoo Bae , Inkeun Baek , Ikseon Jeon , Martin Priwisch
IPC分类号： G01N21/3581 , G01N21/956
CPC分类号： G01N21/3581 , G01N21/956 , G01N2021/95676
摘要： An inspection apparatus is provided. The inspection apparatus includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a receiver antenna arranged on the substrate and including first and second antenna electrodes, a first waveguide on the substrate, and a second waveguide on the substrate, wherein the first antenna electrode overlaps the first waveguide in a third direction that is perpendicular to the first direction and the second direction, and the second antenna electrode overlaps the second waveguide in the third direction.
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公开(公告)号：US20240230528A1
公开(公告)日：2024-07-11
申请号：US18389028
申请日：2023-11-13
发明人： Sunhong Jun , Inkeun Baek , Wontae Kim , Namil Koo , Ingi Kim , Sungyoon Ryu , Younghoon Sohn , Yusin Yang , Ikseon Jeon , Eunhyuk Choi
IPC分类号： G01N21/3581 , G01N21/95 , H01L21/66
CPC分类号： G01N21/3581 , G01N21/9501 , H01L22/12
摘要： A measuring apparatus includes a stage including a transmissive wafer chuck on which a sample wafer is provided, where the sample wafer includes a silicon substrate and at least one material layer on the silicon substrate, a light source unit including a light source configured to generate and output a femtosecond laser beam, and a confocal laser-induced terahertz (THz) emission microscopy (LTEM) unit configured to generate multi-photon excitation by splitting the femtosecond laser beam into four sub-laser beams and causing three sub-laser beams among the four sub-laser beams to be incident in an overlapping manner on a measurement position of the sample wafer, where the confocal LTEM unit is configured to generate the multi-photon excitation based on the three sub-laser beams being incident on a lower surface of the silicon substrate.
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公开(公告)号：US20230417820A1
公开(公告)日：2023-12-28
申请号：US18134731
申请日：2023-04-14
发明人： Martin Priwisch , Alexander Michalski , Michael Nagel , Namil Koo , Suhwan Park , Junbum Park , Inkeun Baek , Jongmin Yoon , Yoonkyung Jang , Ikseon Jeon
IPC分类号： G01R31/265 , G01R1/07
CPC分类号： G01R31/2656 , G01R1/07
摘要： According to embodiments, a cantilever is provided. The cantilever includes a first conductive line, a second conductive line, and a third conductive line extending on the substrate, a microtip arranged on the substrate, and an emitter antenna arranged on the microtip, connected to the first to third conductive lines, and configured to produce a scattering signal of a terahertz wave band, wherein the emitter antenna includes a first emitter electrode connected to the first conductive line, a second emitter electrode connected to the second conductive line and adjacent to the first emitter electrode, a third emitter electrode connected to the third conductive line and spaced apart from the first emitter electrode with the second emitter electrode in-between, and a scattering part connecting the first and second emitter electrodes with each other.
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公开(公告)号：US20220412898A1
公开(公告)日：2022-12-29
申请号：US17719842
申请日：2022-04-13
发明人： Martin Priwisch , Jongmin Yoon , Suhwan Park , Junbum Park , Inkeun Baek , Wonki Lee , Ikseon Jeon , Kwangrak Kim
IPC分类号： G01N22/02
摘要： An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.
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公开(公告)号：US11946881B2
公开(公告)日：2024-04-02
申请号：US17719842
申请日：2022-04-13
发明人： Martin Priwisch , Jongmin Yoon , Suhwan Park , Junbum Park , Inkeun Baek , Wonki Lee , Ikseon Jeon , Kwangrak Kim
摘要： An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.
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公开(公告)号：US11579168B2
公开(公告)日：2023-02-14
申请号：US17488657
申请日：2021-09-29
发明人： Ikseon Jeon , Namil Koo , Junbum Park , Inkeun Baek
摘要： Provided is a probe configured to detect a near field, the probe including a probe substrate having a tip region at an end portion of the probe substrate, a width of the tip region being less than a width of a remaining region of the probe substrate, a first electrode and a second electrode disposed on a surface of the probe substrate, the first electrode and the second electrode being spaced apart from each other and extending from the tip region along the probe substrate, an emitter and a detector disposed between the first electrode and the second electrode, the emitter and the detector being spaced apart from each other in a direction in which the probe substrate extends, and being configured to be photo switched, and a reflector disposed above the emitter and the detector in the direction in which the probe substrate extends opposite to the tip region, and configured to reflect an electromagnetic wave emitted from the emitter.
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公开(公告)号：US20220155340A1
公开(公告)日：2022-05-19
申请号：US17488657
申请日：2021-09-29
发明人： Ikseon Jeon , Namil Koo , Junbum Park , Inkeun Baek
摘要： Provided is a probe configured to detect a near field, the probe including a probe substrate having a tip region at an end portion of the probe substrate, a width of the tip region being less than a width of a remaining region of the probe substrate, a first electrode and a second electrode disposed on a surface of the probe substrate, the first electrode and the second electrode being spaced apart from each other and extending from the tip region along the probe substrate, an emitter and a detector disposed between the first electrode and the second electrode, the emitter and the detector being spaced apart from each other in a direction in which the probe substrate extends, and being configured to be photo switched, and a reflector disposed above the emitter and the detector in the direction in which the probe substrate extends opposite to the tip region, and configured to reflect an electromagnetic wave emitted from the emitter.
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公开(公告)号：US20210366102A1
公开(公告)日：2021-11-25
申请号：US17102700
申请日：2020-11-24
发明人： Suhwan PARK , Namil Koo , Taeheung Ahn , Kwangjun Yoon , Jongmin Yoon , Ikseon Jeon , Jimin Choi
摘要： An inspection apparatus includes a measurement device disposed to be spaced apart from an upper surface of a wafer, an image capturing device configured to capture an image of at least a portion of the measurement device and at least a portion of the upper surface of the wafer, a memory storing an algorithm to measure a distance between the measurement device and the upper surface of the wafer based on the image, and a controller configured to measure the distance between the measurement device and the upper surface of the wafer based on the algorithm, wherein the image includes a measurement region in which the measurement device is displayed, a wafer region in which the wafer is displayed, and a reflective region in which the measurement device being reflected on the upper surface of the wafer is displayed, and wherein the wafer region and the reflective region overlap with each other.
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