SEMICONDUCTOR PACKAGE
    1.
    发明申请

    公开(公告)号:US20230099844A1

    公开(公告)日:2023-03-30

    申请号:US17830488

    申请日:2022-06-02

    Abstract: Provided is a semiconductor package including a first chip substrate including a first surface and a second surface, a through via passing through the first chip substrate, an upper passivation layer including a trench on the second surface of the first chip substrate, the trench exposing at least a portion of the second surface of the first chip substrate, an upper pad electrically connected with the through via on the trench, a second chip substrate including a third surface and a fourth surface, a lower pad electrically connected to the second chip substrate on the third surface of the second chip substrate, and a connection bump electrically connecting the upper pad with the lower pad and contacting the lower pad, wherein a width of the connection bump increases as the connection bump becomes farther away from the first surface of the first chip substrate.

    BANDGAP REFERENCE VOLTAGE GENERATION CIRCUIT AND BANDGAP REFERNECE VOLTAGE GENERATION SYSTEM

    公开(公告)号:US20190079553A1

    公开(公告)日:2019-03-14

    申请号:US15914095

    申请日:2018-03-07

    CPC classification number: G05F3/16 H03K17/567

    Abstract: A bandgap reference voltage generation system includes a common mode voltage generator, a bandgap reference voltage generation circuit, and a switch controller. The bandgap reference voltage generation circuit includes a plurality of transistors having source terminals respectively connected to drain terminals of a plurality of PMOS transistors. The switch controller provides a ground voltage to the bandgap reference voltage generation circuit in a first mode and a common mode voltage to the bandgap reference voltage generation circuit in a second mode. The bandgap reference voltage generation circuit causes the plurality of the transistors to operate in a linear region by providing the common mode voltage to gate electrodes of the plurality of the transistors in the first mode and a saturation region by providing the ground voltage to the gate electrodes of the plurality of the transistors in the second mode.

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