公开(公告)号：US20220346232A1

公开(公告)日：2022-10-27

申请号：US17433832

申请日：2021-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungsoo JUN ,  Changho PARK ,  Jinman KIM ,  Munjin JEONG ,  Wooyoung JEONG ,  Namjun KIM ,  Yonghwa KIM ,  Dongmyeong PARK ,  Youngmoon PARK ,  Youngkyu KIM ,  Minwoo YOO ,  Hyunsuk CHOI

IPC: H05K1/14 ,  H05K7/14 ,  H05K1/02 ,  H05K5/00 ,  H04M1/02

Abstract: An electronic device includes: a housing including a plate and a back plate facing a second surface of the plate and including a planar area facing a first direction, a display module including a display disposed on a first surface of the plate, a battery and a circuit board disposed on the second surface of the plate, a first flexible substrate extending from the display module, and a second flexible substrate extending from the circuit board to the first flexible substrate across the battery. The first flexible substrate includes a first connector, and the second flexible substrate includes a second connector. The first flexible substrate and the second flexible substrate are configured such that the first connector and the second connector are coupled in a second direction different from the first direction.

公开(公告)号：US20210029826A1

公开(公告)日：2021-01-28

申请号：US16930589

申请日：2020-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wooyoung JEONG ,  Yongjin WOO ,  Dongjun KIM ,  Sungchang JANG

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14

Abstract: According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.