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    ELECTRONIC DEVICE HAVING HEAT-RADIATING STRUCTURE
    1.
    发明申请
    ELECTRONIC DEVICE HAVING HEAT-RADIATING STRUCTURE 有权

    公开(公告)号：US20210274637A1

    公开(公告)日：2021-09-02

    申请号：US17262973

    申请日：2019-07-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yonghwa KIM ,  Min PARK ,  Dongil SON ,  Hyunwoo SIM ,  Jaedeok LIM ,  Chunghyo JUNG ,  Seungbum CHOI

    IPC: H05K1/02

    Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

    ELECTRONIC DEVICE WITH SEALING STRUCTURE
    2.
    发明申请
    ELECTRONIC DEVICE WITH SEALING STRUCTURE 审中-公开

    公开(公告)号：US20200084528A1

    公开(公告)日：2020-03-12

    申请号：US16510733

    申请日：2019-07-12

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Wontae JEONG ,  Eungkyu PARK ,  Dongyeop LEE ,  Yonghwa KIM ,  Gihoon LEE ,  Jaehwan LEE ,  Seungbum CHOI ,  Hyounggil CHOI ,  Changryong HEO

    IPC: H04R1/02 ,  H01M2/10 ,  H05K5/00 ,  H05K5/06 ,  H05K5/02 ,  H01F38/14 ,  H05K5/03

    Abstract: An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board,; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.

    ELECTRONIC DEVICE INCLUDING AUDIO OUTPUT MODULE
    7.
    发明申请
    ELECTRONIC DEVICE INCLUDING AUDIO OUTPUT MODULE 有权

    公开(公告)号：US20220386003A1

    公开(公告)日：2022-12-01

    申请号：US17841438

    申请日：2022-06-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Incheol BAEK ,  Yonghwa KIM ,  Yongseung YI ,  Jeonggyu JO ,  Hoyeong LIM

    IPC: H04R1/02 ,  H04R7/12 ,  H04R3/00 ,  H04M1/02

    Abstract: Disclosed is an electronic device including a sound output module. The sound output module includes a sound output housing and a motor unit positioned in an inner space and communicating with an inner space of the speaker unit to generate a vibration force. The motor unit may include a motor body forming a volume space communicating with the inner space of the speaker unit and a vibration body positioned in the motor body to generate a vibration force. A communication hole may be formed in an outer wall of the motor body for the inner space of the speaker unit and the volume space to communicate with each other.

    ELECTRONIC APPARATUS COMPRISING CONNECTOR OF STACKED STRUCTURE
    9.
    发明申请
    ELECTRONIC APPARATUS COMPRISING CONNECTOR OF STACKED STRUCTURE 有权

    公开(公告)号：US20210044686A1

    公开(公告)日：2021-02-11

    申请号：US16966797

    申请日：2019-01-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junghoon PARK ,  Yonghwa KIM ,  Hyangbok LEE ,  Dongil SON

    IPC: H04M1/02 ,  H01R12/52 ,  H01R12/55 ,  H01R13/10

    Abstract: Disclosed is an electronic device that includes a first printed circuit board including at least one electronic part, a first header mounted on the first printed circuit board, a first module that includes, on a first surface thereof, a first socket for engagement with the first header and includes a second header on a second surface opposite to the first surface and that performs a first function, a second module that includes, on one surface thereof, a second socket for engagement with the second header and that performs a second function, and a processor electrically connected with the first header, wherein the processor is configured to transfer at least one first signal for control of the first module or at least one second signal for control of the second module to the first header. Besides, it may be permissible to prepare various other embodiments speculated through the specification.

    CONDUIT STRUCTURE OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
    10.
    发明申请
    CONDUIT STRUCTURE OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20190320050A1

    公开(公告)日：2019-10-17

    申请号：US16387059

    申请日：2019-04-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinho LIM ,  Seungjae BAE ,  Yonghwa KIM ,  Jinyoung PARK ,  Bokyung SIM ,  Byounguk YOON

    IPC: H04M1/03 ,  H04R1/02 ,  H04R1/32

    Abstract: A conduit structure of an electronic device and an electronic device are provided. The conduit structure includes an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure; a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure; a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure; a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure; and a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.

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