SEMICONDUCTOR DEVICE
    2.
    发明公开

    公开(公告)号:US20240324177A1

    公开(公告)日:2024-09-26

    申请号:US18604705

    申请日:2024-03-14

    CPC classification number: H10B12/315 H01L29/78642 H01L29/7869

    Abstract: A semiconductor device includes a substrate, a bit line that extends in a first horizontal direction on the substrate, a first mold layer on the bit line, wherein the first mold layer defines a mold opening that exposes a portion of an upper surface of the bit line and extends in a second horizontal direction that intersects the first horizontal direction, a channel layer on the bit line, one or more word lines on sidewalls of the channel layer and that extend in the second horizontal direction, and a gate insulating layer between the word line and the channel layer, where the channel layer includes a first oxide semiconductor layer, a second oxide semiconductor layer, and an auxiliary channel layer between the first oxide semiconductor layer and the second oxide semiconductor layer.

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