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公开(公告)号：US20180294245A1
公开(公告)日：2018-10-11
申请号：US15853170
申请日：2017-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： YOUNGSIK KIM , DOOJIN KIM , SEOKHO LEE , YOUNGGON HWANG
Abstract: A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.
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