公开(公告)号：US10804212B2

公开(公告)日：2020-10-13

申请号：US16280186

申请日：2019-02-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeong-Kwon Ko ,  Jun-Yeong Heo ,  Un-Byoung Kang ,  Ja-Yeon Lee

IPC: H01L25/04 ,  H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18 ,  H01L21/78

Abstract: A semiconductor package includes a package substrate, a first semiconductor device on an upper surface of the package substrate, a second semiconductor device on an upper surface of the first semiconductor device, a first connection bump attached to a lower surface of the package substrate, a second connection bump interposed between and electrically connected to the package substrate and the first semiconductor device, and a third connection bump interposed between and electrically connected to the first semiconductor device and the second semiconductor device. The first semiconductor device has an edge and a step at the edge.