公开(公告)号：US20230361054A1

公开(公告)日：2023-11-09

申请号：US18115545

申请日：2023-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin SEOL ,  Jungeun Koo ,  Tongsuk Kim ,  Youngjun Yoon ,  Mijeong Jeong ,  Younghun Jung

IPC: H01L23/58 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16 ,  H01Q9/04

CPC classification number: H01L23/585 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/16 ,  H01Q9/0407

Abstract: Provided is a semiconductor package including a redistribution structure including first surface and a second surface opposite to each other, the redistribution structure including a redistribution layer, a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer, an encapsulant on the semiconductor chip, at least one antenna pattern on the encapsulant, a side wiring line extending along a surface of the encapsulant from one end of the antenna pattern to the redistribution layer, and electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer, wherein the semiconductor chip and the antenna pattern are configured to transmit and receive a signal to and from each other through the electronic devices.