公开(公告)号：US20240321619A1

公开(公告)日：2024-09-26

申请号：US18439492

申请日：2024-02-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunjae Lee ,  Jun Hyung Kim ,  Sangyeon Oh ,  Jihyeong Lee ,  Yonjoo Kang ,  Youngil Kang ,  Minsung Kim ,  Inhwan Park

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01L21/02271

Abstract: The present disclosure relates to substrate supporters and substrate processing apparatuses. An example substrate supporter includes an upper surface on which a substrate is loaded, a base, an outer dam extending along an edge of the base, a contact band connected with the outer dam, extending along the circumferential direction of the base, and onto which the substrate is loaded, and a first contact pattern disposed adjacent to the contact band and extending into an inside of the contact band, the first contact pattern extending along the circumferential direction of the base, where an area of the first contact pattern is larger than an area where the contact band overlaps with the substrate.