公开(公告)号：US10468752B2

公开(公告)日：2019-11-05

申请号：US15182792

申请日：2016-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho-Jin Jung ,  Hyoung-Hwan Roh ,  Young-Jae Jang ,  Il-Jong Song

IPC: H01Q1/24 ,  H04B5/00 ,  H04W4/80 ,  H01Q1/40 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q21/28

Abstract: A wireless communication module includes a controller configured to control wireless communication operations, an antenna module that includes a first antenna device, and a matching circuit configured to perform impedance matching between the controller and the antenna module, wherein the first antenna device includes a heat dissipating sheet with a first pattern that transceives wireless signals by detecting a surrounding magnetic flux.