公开(公告)号：US09666454B2

公开(公告)日：2017-05-30

申请号：US14579609

申请日：2014-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Ho Choi ,  Young-Suk Sim

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67017 ,  H01L21/67309 ,  H01L21/6732 ,  Y10T29/49826

Abstract: A wafer storage apparatus includes a wafer stacking portion that encloses an internal space with an open front side for receiving a plurality of wafers; a rear cover portion disposed on the back side of the wafer stacking portion; and a gas charging portion that includes a plurality of gas supply blocks disposed on the inner side of the rear cover portion, a plurality of gas supply pipes connected to the gas supply blocks via through holes in the rear cover portion, and a gas supply unit connected to the gas supply pipes.

公开(公告)号：US20150206780A1

公开(公告)日：2015-07-23

申请号：US14579609

申请日：2014-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： IN-HO CHOI ,  Young-Suk Sim

IPC: H01L21/673

CPC classification number: H01L21/67017 ,  H01L21/67309 ,  H01L21/6732 ,  Y10T29/49826

Abstract: A wafer storage apparatus includes a wafer stacking portion that encloses an internal space with an open front side for receiving a plurality of wafers; a rear cover portion disposed on the back side of the wafer stacking portion; and a gas charging portion that includes a plurality of gas supply blocks disposed on the inner side of the rear cover portion, a plurality of gas supply pipes connected to the gas supply blocks via through holes in the rear cover portion, and a gas supply unit connected to the gas supply pipes.

Abstract translation: 晶片存储装置包括晶片堆叠部分，其包围具有用于容纳多个晶片的开放正面的内部空间; 设置在所述晶片堆叠部的背侧的后盖部; 以及气体充填部，其包括设置在所述后盖部的内侧的多个供气块，经由所述后盖部中的通孔与所述气体供给块连接的多个气体供给管，以及气体供给部 连接到供气管。