公开(公告)号：US20200321270A1

公开(公告)日：2020-10-08

申请号：US16904648

申请日：2020-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YoungJoon LEE ,  Sunwon KANG

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10

Abstract: Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.