公开(公告)号：US20200373209A1

公开(公告)日：2020-11-26

申请号：US16698160

申请日：2019-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Do-Hyun KIM ,  Sunwon KANG ,  Hogeon SONG ,  Kyung Suk OH

IPC: H01L21/66 ,  H01L23/544 ,  H01L21/67 ,  H01L21/304 ,  H01L21/18

Abstract: An inspection system for a semiconductor package includes an inspection apparatus that includes a stage on which the semiconductor package is loaded, and a computer coupled to the inspection apparatus. The semiconductor package may include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip, the computer may provide first identification information about the first semiconductor chip and second identification information about the second semiconductor chip, and the computer may control the inspection apparatus to selectively perform a package test process on one of the first and second semiconductor chips, the one of the first and second semiconductor chips being identified as a good chip based on the first identification information and the second identification information.

公开(公告)号：US20250033132A1

公开(公告)日：2025-01-30

申请号：US18748513

申请日：2024-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngja KIM ,  Sunwon KANG

IPC: B23K3/08 ,  B23K3/04 ,  B23K101/40 ,  H01L23/00

Abstract: A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated; a heater configured to heat the heat transfer fluid to generate saturated vapor; a substrate stage configured to be moved up and down within the vapor generating chamber and configured to support a substrate on which an electronic component is mounted via solder; a cleaning portion installed in an upper portion of the vapor generating chamber, wherein the cleaning portion is configured to spray a cleaning fluid onto the substrate on the substrate stage, wherein the cleaning fluid includes a material the same as the heat transfer fluid; and a guide structure configured to collect the cleaning fluid sprayed onto the substrate on the substrate stage and to direct the cleaning fluid to a reservoir that contains the heat transfer fluid.

公开(公告)号：US20220199529A1

公开(公告)日：2022-06-23

申请号：US17392936

申请日：2021-08-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Young KIM ,  Sunwon KANG

IPC: H01L23/528 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: Disclosed is a semiconductor package including a semiconductor chip that includes a chip pad on one surface of the semiconductor chip, a redistribution pattern on the one surface of the semiconductor chip and electrically connected to the chip pad, and a photosensitive dielectric layer between the semiconductor chip and the redistribution pattern. The photosensitive dielectric layer may be in physical contact with the redistribution pattern. The redistribution pattern includes a signal redistribution pattern, a ground redistribution pattern, and a power redistribution pattern. A vertical distance between the chip pad and the signal redistribution pattern may be greater than a width of the signal redistribution pattern.

公开(公告)号：US20200321270A1

公开(公告)日：2020-10-08

申请号：US16904648

申请日：2020-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YoungJoon LEE ,  Sunwon KANG

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10

Abstract: Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.