公开(公告)号：US20230052565A1

公开(公告)日：2023-02-16

申请号：US17718635

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyeon CHANG ,  Hyunah KIM ,  Younghyun YOU ,  Younghwan JIN ,  Junho CHOI

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate debonding apparatus includes a chuck attached to a second surface opposite to the first surface of the semiconductor substrate via a second adhesive layer. The chuck is configured to support a lower portion of a base film having a cross-sectional area in a horizontal direction greater than a cross-sectional area of the semiconductor substrate in the horizontal direction. The semiconductor debonding apparatus further includes a fixing ring arranged above the chuck and configured to fix in position an edge portion of the base film, and a cover ring arranged above the fixing ring and configured to adjust a diameter of an opening exposing the carrier substrate. The cover ring includes a guide frame arranged above the fixing ring, and a plurality of cover blades configured to move in a horizontal direction determined by the guide frame.