公开(公告)号：US20140145369A1

公开(公告)日：2014-05-29

申请号：US14169258

申请日：2014-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngshin Choi ,  Kikwon Jeong

IPC: H01L21/02

CPC classification number: H01L21/02 ,  B29C45/14655 ,  B29C45/56 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract translation: 用于制造半导体封装的装置可以包括模具和模制板。 模具可以限定模具腔，模具被配置为容纳模腔中的电路板，并且电路板可以包括安装在其上的半导体芯片。 模制板可以在模腔中移动，模制板被配置成调节模腔的体积。 还讨论了相关方法。

公开(公告)号：US11658147B2

公开(公告)日：2023-05-23

申请号：US17489310

申请日：2021-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilhyoung Koo ,  Youngshin Choi ,  Changho Lee

IPC: B23K1/00 ,  H01L23/00 ,  B23K1/018 ,  B23K1/20 ,  B23K101/40

CPC classification number: H01L24/75 ,  B23K1/018 ,  B23K1/206 ,  H01L24/799 ,  B23K2101/40 ,  H01L2224/7501 ,  H01L2224/7555 ,  H01L2224/75263 ,  H01L2224/75753

Abstract: A semiconductor manufacturing apparatus includes; a component separating apparatus configured to separate a defective component from a substrate, a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter to provide a conditioned first connection bump, and the first connection bump being exposed by separating the defective component from the substrate, and a component attaching apparatus configured to receive the substrate following provision of the conditioned first connection bump, and mount a new component including a second connection bump to the substrate by coupling the second connection bump and the conditioned first connection bump.

公开(公告)号：US09028736B2

公开(公告)日：2015-05-12

申请号：US14169258

申请日：2014-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngshin Choi ,  Kikwon Jeong

IPC: B29C45/14 ,  H01L21/02 ,  B29C45/56

CPC classification number: H01L21/02 ,  B29C45/14655 ,  B29C45/56 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract translation: 用于制造半导体封装的装置可以包括模具和模制板。 模具可以限定模具腔，模具被配置为容纳模腔中的电路板，并且电路板可以包括安装在其上的半导体芯片。 模制板可以在模腔中移动，模制板被配置成调节模腔的体积。 还讨论了相关方法。