公开(公告)号：US09929061B2

公开(公告)日：2018-03-27

申请号：US14311235

申请日：2014-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Min Cho ,  Changho Lee ,  Ilhyoung Koo ,  Baeki Lee ,  Jongkeun Jeon

IPC: H05K13/04 ,  H01L21/66 ,  H05K13/08

CPC classification number: H01L22/10 ,  H05K13/0417 ,  H05K13/08 ,  H05K13/082 ,  Y10T29/53022

Abstract: A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.

公开(公告)号：US10147653B2

公开(公告)日：2018-12-04

申请号：US15899148

申请日：2018-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Min Cho ,  Changho Lee ,  Ilhyoung Koo ,  Baeki Lee ,  Jongkeun Jeon

IPC: H05K13/04 ,  H01L21/66 ,  H05K13/08

Abstract: A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.

公开(公告)号：US11658147B2

公开(公告)日：2023-05-23

申请号：US17489310

申请日：2021-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilhyoung Koo ,  Youngshin Choi ,  Changho Lee

IPC: B23K1/00 ,  H01L23/00 ,  B23K1/018 ,  B23K1/20 ,  B23K101/40

CPC classification number: H01L24/75 ,  B23K1/018 ,  B23K1/206 ,  H01L24/799 ,  B23K2101/40 ,  H01L2224/7501 ,  H01L2224/7555 ,  H01L2224/75263 ,  H01L2224/75753

Abstract: A semiconductor manufacturing apparatus includes; a component separating apparatus configured to separate a defective component from a substrate, a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter to provide a conditioned first connection bump, and the first connection bump being exposed by separating the defective component from the substrate, and a component attaching apparatus configured to receive the substrate following provision of the conditioned first connection bump, and mount a new component including a second connection bump to the substrate by coupling the second connection bump and the conditioned first connection bump.