公开(公告)号：US20230250280A1

公开(公告)日：2023-08-10

申请号：US18118453

申请日：2023-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  HANWHA COMPOUND CORPORATION

Inventor： Hangyu HWANG ,  Pranveer Singh RATHORE ,  Kyungrae KIM ,  Changyun SHIN ,  Sambong JEONG ,  Gukhyun HAN ,  Bongjoon KIM ,  Jinsoo LEE

IPC: C08L77/10 ,  C08L23/18 ,  G06F1/16

CPC classification number: C08L77/10 ,  C08L23/18 ,  G06F1/1633 ,  C08L2203/206 ,  C08L2207/20

Abstract: Polymer compositions include a recycled polyamide and an electronic device and a protective case for an electronic device including the same. The polymer composition according to various embodiments of the present disclosure may include a recycled polyamide, a new polyamide including at least one polyamide component, a glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler. In some embodiments, the recycled polyamide may include a polyamide collected from marine plastic waste.