公开(公告)号：US20230101674A1

公开(公告)日：2023-03-30

申请号：US17718754

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS Co., LTD.

Inventor： Youn Gon OH ,  Ji Hun KIM ,  SaeYun KO ,  Gil Ho GU ,  Dong Su KIM ,  Eun Hee LEE ,  Ho Chan LEE ,  Seong Sil JEONG ,  Seong Pyo HONG

IPC: H01L21/673 ,  H01L21/66

Abstract: Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.

公开(公告)号：US20230067060A1

公开(公告)日：2023-03-02

申请号：US17690317

申请日：2022-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon OH ,  Ji Hun KIM ,  Sae Yun KO ,  Gil Ho GU ,  Dong Su KIM ,  Eun Hee LEE ,  Ho Chan LEE ,  Seong Sil JEONG ,  Seong Pyo HONG

IPC: G01R31/28 ,  H01L21/673 ,  H01L21/677

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

公开(公告)号：US20230122548A1

公开(公告)日：2023-04-20

申请号：US17885831

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Su KIM ,  Jun Suk BANG

IPC: H03F1/02 ,  H02M3/158 ,  H02M1/00 ,  H03F3/24 ,  H03F3/72

Abstract: A semiconductor device is provided. The semiconductor device comprises an output terminal from which an output voltage is output, a switching converter configured to control the output voltage on the basis of a first reference voltage, a load capacitor configured to be charged with a voltage corresponding to the output voltage, a linear amplifier connected to one end of an alternating current (AC) coupling capacitor and configured to control a voltage of the AC coupling capacitor on the basis of a second reference voltage, and a switching circuit configured to control a charging speed of the load capacitor and control a connection between the output terminal and one end and another end of the AC coupling capacitor.

公开(公告)号：US20230006543A1

公开(公告)日：2023-01-05

申请号：US17658317

申请日：2022-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Kwang LEE ,  Young Hwan CHOO ,  Dong Su KIM

IPC: H02M1/44 ,  H03H1/00 ,  H03H9/64 ,  H02M1/096 ,  H03H9/52

Abstract: A power noise filter and a supply modulator including the same, and a wireless communication device including the power noise filter are provided. The power noise filter includes a band stop filter and a low pass filter. The band stop filter includes an inductor and a first capacitor, which are connected in parallel between first and second nodes. The first node receives a first voltage, which is filtered by the band pass filter to thereby generate a second voltage at the second node. The first low pass filter includes the inductor and a second capacitor, which has one end connected to the second node and an opposite end connected to a ground source.