公开(公告)号：US20230002618A1

公开(公告)日：2023-01-05

申请号：US17845043

申请日：2022-06-21

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Ieju KIM ,  Chaehyuk KO ,  Sundae KIM ,  Baek Soung PARK ,  Yeji YANG ,  Young LEE ,  Jungsun LEE ,  Myungho CHO ,  Xinhui FENG

IPC: C09B57/00 ,  G03F7/00 ,  G03F7/105 ,  C09B67/02 ,  C07D401/14

Abstract: A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1 and a shell surrounding the core, the shell being represented by Chemical Formula 2:

公开(公告)号：US20220100085A1

公开(公告)日：2022-03-31

申请号：US17487515

申请日：2021-09-28

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Young LEE ,  Sundae KIM ,  Yeji YANG ,  Chaehyuk KO ,  Ieju KIM ,  Arum YU ,  Myungho CHO ,  Xinhui FENG ,  Jungsun LEE

IPC: G03F7/00 ,  G03F7/027 ,  G02B1/04 ,  H01L27/146

Abstract: A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer produced using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1; and a shell surrounding the core, the shell being represented by Chemical Formula 2: