公开(公告)号：US20220254707A1

公开(公告)日：2022-08-11

申请号：US17629916

申请日：2020-07-24

Applicant: SAMTEC, INC.

Inventor： Chihhao CHEN ,  Edwin LOY ,  Yan Yang ZHAO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.