公开(公告)号：US20220350089A1

公开(公告)日：2022-11-03

申请号：US17424052

申请日：2020-01-17

Applicant: SAMTEC, INC.

Inventor： Matthew Brian PUFFER ,  Raymond LEE ,  R. Brad BETTMAN ,  Edwin LOY ,  Dyan SEVILLE-JONES ,  Arlon MARTIN ,  Stephen Michael GIRLANDO ,  Christopher Alan BANDFIELD

IPC: G02B6/42

Abstract: This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.

公开(公告)号：US20220254707A1

公开(公告)日：2022-08-11

申请号：US17629916

申请日：2020-07-24

Applicant: SAMTEC, INC.

Inventor： Chihhao CHEN ,  Edwin LOY ,  Yan Yang ZHAO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.

公开(公告)号：US20200220286A1

公开(公告)日：2020-07-09

申请号：US16604023

申请日：2018-04-10

Applicant: SAMTEC, INC.

Inventor： R. Brad BETTMAN ,  Liam PARKES ,  Eric ZBINDEN ,  Keith GUETIG ,  Jignesh H. SHAH ,  Jean Karlo WILLIAMS BARNETT ,  Chadrick Paul FAITH ,  Edwin LOY

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/73

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.