公开(公告)号：US11071201B2

公开(公告)日：2021-07-20

申请号：US16764311

申请日：2018-11-14

Applicant: SAMTEC, INC.

Inventor： James Dunlop

IPC: H05K1/11 ,  H01R12/53 ,  H05K1/02

Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

公开(公告)号：US20210345486A1

公开(公告)日：2021-11-04

申请号：US17378949

申请日：2021-07-19

Applicant: Samtec, Inc.

Inventor： James Dunlop

IPC: H05K1/11 ,  H01R12/53 ,  H05K1/02

Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

公开(公告)号：US11576260B2

公开(公告)日：2023-02-07

申请号：US17378949

申请日：2021-07-19

Applicant: Samtec, Inc.

Inventor： James Dunlop

IPC: H01R12/53 ,  H05K1/11 ,  H05K1/02

Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.