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公开(公告)号：US20250087569A1
公开(公告)日：2025-03-13
申请号：US18549742
申请日：2022-03-10
Applicant: SAMTEC, INC.
Inventor： Thomas Jacob HAMMANN , Adam OWENS , Christopher BOHN , Nathan HAGAN , Nathan ROBERTSON , Peter WRSCHKA
IPC: H01L23/498
Abstract: Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.
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