公开(公告)号：US20250087569A1

公开(公告)日：2025-03-13

申请号：US18549742

申请日：2022-03-10

Applicant: SAMTEC, INC.

Inventor： Thomas Jacob HAMMANN ,  Adam OWENS ,  Christopher BOHN ,  Nathan HAGAN ,  Nathan ROBERTSON ,  Peter WRSCHKA

IPC: H01L23/498

Abstract: Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.

公开(公告)号：US20240196540A1

公开(公告)日：2024-06-13

申请号：US18554556

申请日：2022-04-11

Applicant: SAMTEC, INC.

Inventor： Christopher David BOHN ,  Mark CRAIN ,  Justin ROEHM ,  Thomas Jacob HAMMANN ,  Nathan ROBERTSON ,  Jeremy BROWN ,  Christopher PELKEY ,  Adam OWENS ,  Russell PAYTON ,  Russell FRANK

IPC: H05K3/00 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K3/0094 ,  H01L21/486 ,  H01L23/49827 ,  H05K1/115 ,  H05K3/426 ,  H05K2203/128

Abstract: A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.

公开(公告)号：US20230005834A1

公开(公告)日：2023-01-05

申请号：US17765365

申请日：2020-09-30

Applicant: SAMTEC, INC.

Inventor： Alan D. NOLET ,  Andrew Haynes LIOTTA ,  Troy Benton HOLLAND ,  Thomas Jacob HAMMANN ,  Heidi BATES ,  Daniel GOIA ,  Vishwas Vnayak HARDIKAR ,  Ajeet KUMAR ,  Daniel US LONG ,  Nicole MCGRAW ,  Lauren Savawn MOEN ,  Adam OWENS

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H05K1/03 ,  H05K1/11

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.