公开(公告)号：US20220350089A1

公开(公告)日：2022-11-03

申请号：US17424052

申请日：2020-01-17

Applicant: SAMTEC, INC.

Inventor： Matthew Brian PUFFER ,  Raymond LEE ,  R. Brad BETTMAN ,  Edwin LOY ,  Dyan SEVILLE-JONES ,  Arlon MARTIN ,  Stephen Michael GIRLANDO ,  Christopher Alan BANDFIELD

IPC: G02B6/42

Abstract: This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.