公开(公告)号：US20220010445A1

公开(公告)日：2022-01-13

申请号：US17295007

申请日：2019-11-27

Applicant: SAMWON ACT CO., LTD.

Inventor： Kyung Yul LEE ,  Kwang Jong CHOI ,  Heung Hyeon SONG ,  Eun Yoo CHOI

IPC: C25D1/04 ,  C25D7/06 ,  H05K3/20

Abstract: Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.