中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

16 records (took 0.012 seconds)

    CIRCUIT PATTERN CONTINUOUS MANUFACTURING DEVICE
    7.
    发明申请
    CIRCUIT PATTERN CONTINUOUS MANUFACTURING DEVICE 有权

    公开(公告)号：US20220010445A1

    公开(公告)日：2022-01-13

    申请号：US17295007

    申请日：2019-11-27

    Applicant: SAMWON ACT CO., LTD.

    Inventor： Kyung Yul LEE ,  Kwang Jong CHOI ,  Heung Hyeon SONG ,  Eun Yoo CHOI

    IPC: C25D1/04 ,  C25D7/06 ,  H05K3/20

    Abstract: Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

    Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern
    9.
    发明授权
    Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern 有权

    公开(公告)号：US11665828B2

    公开(公告)日：2023-05-30

    申请号：US17295015

    申请日：2019-11-27

    Applicant: SAMWON ACT CO., LTD.

    Inventor： Kyung Yul Lee ,  Kwang Jong Choi ,  Pyoung Woo Lee ,  Doo Yul Baek

    IPC: H05K3/02 ,  H05K1/03

    CPC classification number: H05K3/025 ,  H05K1/0353 ,  H05K2201/0154

    Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).

    UNIT BRACKET, BRACKET AND BRACKET CONSTRUCTION METHOD FOR ATTACHING TO BASE MATERIAL AND WALL USING THE SAME
    10.
    发明申请
    UNIT BRACKET, BRACKET AND BRACKET CONSTRUCTION METHOD FOR ATTACHING TO BASE MATERIAL AND WALL USING THE SAME 有权

    公开(公告)号：US20220195737A1

    公开(公告)日：2022-06-23

    申请号：US17371260

    申请日：2021-07-09

    Applicant: SAMWON ACT CO., LTD.

    Inventor： Kyung Wook LEE ,  Kyung Yul LEE ,  Hong Seok HAN

    IPC: E04F13/08

    Abstract: The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.

Patent Agency Ranking