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公开(公告)号：US20230188109A1
公开(公告)日：2023-06-15
申请号：US18077259
申请日：2022-12-08
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
CPC classification number: H03H3/02 , H03H9/215 , H03H2003/026
Abstract: Provided is a method for manufacturing a vibrator element including a first vibration arm and a second vibration arm that each have a first surface and a second surface. The manufacturing method includes a preparation step of preparing a quartz crystal substrate, a first protective film forming step of forming a first protective film on a first substrate surface of the quartz crystal substrate, a first dry etching step of dry etching the quartz crystal substrate via the first protective film, a second protective film forming step of forming a second protective film on a second substrate surface of the quartz crystal substrate, and a second dry etching step of dry etching the quartz crystal substrate via the second protective film. Outer shapes of the first vibration arm and the second vibration arm are formed from the first surface to the second surface in the first dry etching step, and the outer shapes of the first vibration arm and the second vibration arm are not formed in the second dry etching step.
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公开(公告)号：US20230127801A1
公开(公告)日：2023-04-27
申请号：US17970657
申请日：2022-10-21
Applicant: SEIKO EPSON CORPORATION
Inventor： Shigeru SHIRAISHI , Hiyori SAKATA , Keiichi YAMAGUCHI , Ryuta NISHIZAWA
IPC: H03H9/215 , H01L41/18 , H01L41/332 , G01C19/5628
Abstract: A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.
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公开(公告)号：US20230139098A1
公开(公告)日：2023-05-04
申请号：US17974653
申请日：2022-10-27
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
Abstract: A method for manufacturing a vibration element including a first protective film formation step of forming a first protective film, a first dry etching step of performing dry etching via the first protective film to form first grooves and the outer shapes of vibrating arms, a second protective film formation step of forming a second protective film in the first grooves, a second dry etching step of performing dry etching via the second protective film, a third protective film formation step of forming a third protective film, a third dry etching step of performing dry etching via the third protective film to form second grooves and the outer shapes of the vibrating arms, a fourth protective film formation step of forming a fourth protective film in the second grooves, and a fourth dry etching step of performing dry etching via the fourth protective film.
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公开(公告)号：US20230134199A1
公开(公告)日：2023-05-04
申请号：US17974671
申请日：2022-10-27
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
Abstract: A method for manufacturing a vibration element including first and second vibrating arms each having a first surface and a second surface that are front and rear sides with respect to each other and a bottomed groove that opens via the first surface, the method including a first protective film formation step of forming a first protective film, a first dry etching step of performing dry etching via the first protective film to form grooves and the outer shapes of the first and second vibrating arms, a second protective film formation step of forming a second protective film in the grooves, and a second dry etching step of performing dry etching via the second protective film to form the first surface and the outer shapes of the first and second vibrating arms.
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公开(公告)号：US20230126632A1
公开(公告)日：2023-04-27
申请号：US17970645
申请日：2022-10-21
Applicant: SEIKO EPSON CORPORATION
Inventor： Shigeru SHIRAISHI , Hiyori SAKATA , Keiichi YAMAGUCHI , Ryuta NISHIZAWA
Abstract: A method for manufacturing a vibration element includes, a first base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a first protective film forming step of forming a first protective film in a first bank portion forming region of the first base film, a first dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film, a second base film forming step of forming a second base film at a second substrate surface of the quartz crystal substrate in the first and second vibrating arm forming regions, a second protective film forming step of forming a second protective film in a second bank portion forming region of the second base film, and a second dry-etching step of dry-etching the quartz crystal substrate through the second base film and the second protective film.
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Patent Agency Ranking
公开(公告)号：US20240056053A1
公开(公告)日：2024-02-15
申请号：US18446526
申请日：2023-08-09
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
CPC classification number: H03H9/215 , H03H3/02 , H03H2003/026
Abstract: A manufacturing method for a vibrator element includes a preparation step of preparing a quartz crystal substrate having a first substrate surface and a second substrate surface, a first protective film formation step of forming a first protective film in first groove formation areas of the first substrate surface, a second protective film formation step of forming a second protective film in an area except the first groove formation areas of a first vibrating arm formation area and a second vibrating arm formation area of the first substrate surface, and a first dry etching step of dry etching the quartz crystal substrate from the first substrate surface side via the first protective film and the second protective film and forming a first surface, first grooves, and outer shapes of the first vibrating arm and the second vibrating arm, wherein r1>r2, where an etching rate of the first protective film is r1 and an etching rate of the second protective film is r2.
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公开(公告)号：US20230179164A1
公开(公告)日：2023-06-08
申请号：US18072988
申请日：2022-12-01
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
CPC classification number: H03H3/02 , H03H9/215 , H03H2003/026
Abstract: A method for manufacturing a vibrator element includes a first protective film forming step of forming a first protective film on a first substrate surface of a quartz crystal substrate, a first dry etching step of dry etching the quartz crystal substrate from a first substrate surface side to form a first groove and outer shapes of a first and second vibration arms, a second protective film forming step of forming a second protective film on a second substrate surface of the quartz crystal substrate, and a second dry etching step of dry etching the quartz crystal substrate from a second substrate surface side to form a second groove and outer shapes of the first and second vibration arms. In the first dry etching step, the outer shapes of the first and second vibration arms are formed to be closer to the second substrate surface than is a position where a bottom surface of the second groove is formed.
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公开(公告)号：US20220271735A1
公开(公告)日：2022-08-25
申请号：US17679319
申请日：2022-02-24
Applicant: Seiko Epson Corporation
Inventor： Hiyori SAKATA , Takuro KOBAYASHI , Ryuta NISHIZAWA , Keiichi YAMAGUCHI , Shigeru SHIRAISHI
Abstract: A method for manufacturing a vibration element includes: a preparing step of preparing a quartz crystal substrate having a first surface and a second surface; a protective film forming step of forming a protective film on the first surface of the quartz crystal substrate, excluding groove forming regions where grooves are formed and an inter-arm region located between a first vibrating arm forming region where a first vibrating arm is formed and a second vibrating arm forming region where a second vibrating arm is formed; and a dry etching step of dry etching the quartz crystal substrate from a first surface side via the protective film and forming the grooves and contours of the first vibrating arm and the second vibrating arm. Wa/Aa
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公开(公告)号：US20230102578A1
公开(公告)日：2023-03-30
申请号：US17953852
申请日：2022-09-27
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
IPC: H01L41/332 , H01L41/29
Abstract: A method of manufacturing a vibration element includes: a first protective film forming step of forming a first protective film on a first substrate surface of a crystal substrate; a first dry etching step of dry-etching the crystal substrate via the first protective film; a second protective film forming step of forming a second protective film on a second substrate surface of the crystal substrate; and a second dry etching step of dry-etching the crystal substrate via the second protective film. A relationship of T1
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公开(公告)号：US20230097025A1
公开(公告)日：2023-03-30
申请号：US17953916
申请日：2022-09-27
Applicant: SEIKO EPSON CORPORATION
Inventor： Keiichi YAMAGUCHI , Hiyori SAKATA , Shigeru SHIRAISHI , Ryuta NISHIZAWA
Abstract: A method of manufacturing a vibration element includes: a protective film forming step of forming a protective film on a first substrate surface of a crystal substrate; and a dry etching step of dry-etching the crystal substrate via the protective film. The protective film satisfies a relationship of T1
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