公开(公告)号：US09589902B2

公开(公告)日：2017-03-07

申请号：US14672811

申请日：2015-03-30

申请人： SEIKO INSTRUMENTS INC.

发明人： Yasunobu Matsumoto ,  Masaki Suzuki ,  Makoto Asou ,  Hiroshi Morita

IPC分类号： H01L23/544 ,  H01L25/18

CPC分类号： H01L23/544 ,  H01L25/18 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/5444 ,  H01L2223/54466 ,  H01L2223/54493 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer has formed thereon various types of semiconductor chips and enables different types of semiconductor chips having the same chip size to be easily distinguished. An excluded region is formed on an outer periphery of the semiconductor wafer, and a region inside the excluded region is divided into different types of regions by boundaries. Mark chips are respectively arranged in the vicinity of both ends of the boundaries.

摘要翻译： 半导体晶片在其上形成有各种类型的半导体芯片，并且能够容易地区分具有相同芯片尺寸的不同类型的半导体芯片。 在半导体晶片的外周形成排除区域，排除区域内的区域由边界划分为不同种类的区域。 标记芯片分别布置在边界两端附近。