公开(公告)号：US20130167346A1

公开(公告)日：2013-07-04

申请号：US13728402

申请日：2012-12-27

Applicant: SEIKO PRECISION INC.

Inventor： Ikuo SHIOZAWA ,  Tsutomu SAITO ,  Takeshi TOKAIRIN ,  Koji YONEDA

IPC: B23P11/00

CPC classification number: B23P11/00 ,  H05K3/0008 ,  H05K3/0038 ,  H05K3/0055 ,  H05K2203/0346 ,  Y10T29/51

Abstract: The X-ray processing device comprises a work table on which a processing object is placed, X-ray processors irradiating the processing object placed in a given processing zone on the work table with an X-ray for processing, a pressing member, and X-ray shielding sheets. The pressing member presses and collapses any remaining raised edges at the sides of the processing object. The X-ray shielding sheets are provided on the side of the pressing member that is closest to the processing zone and shield the X-ray from the X-ray processors.

Abstract translation: X射线处理装置包括：放置处理对象的工作台，将X射线处理器照射放置在工作台上的给定处理区域中的处理对象的X射线处理对象用X射线进行处理，按压部件和X 射线屏蔽片。 按压构件在处理对象的侧面按压和折叠任何剩余的凸起边缘。 X射线屏蔽片设置在最靠近处理区域的按压构件的一侧，并且从X射线处理器屏蔽X射线。