公开(公告)号：US20240114671A1

公开(公告)日：2024-04-04

申请号：US18538224

申请日：2023-12-13

申请人： ASMPT GmbH & Co. KG

发明人： Martin NEUSSER ,  Jetulla AVDILI

IPC分类号： H05K13/00 ,  H05K3/00 ,  H05K13/04

CPC分类号： H05K13/0069 ,  H05K3/0008 ,  H05K13/04 ,  H05K2203/1178

摘要： The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).

公开(公告)号：US11877387B2

公开(公告)日：2024-01-16

申请号：US17317150

申请日：2021-05-11

申请人： Schmoll Maschinen GmbH

发明人： Markus Winterschladen ,  Abdullah Taymuree ,  Peter Knief

IPC分类号： H05K1/02 ,  G01N23/083 ,  G06T7/00 ,  H05K3/00

CPC分类号： H05K1/0269 ,  G01N23/083 ,  G06T7/0004 ,  H05K3/0008 ,  H05K3/0047 ,  G06T2207/30141 ,  G06T2207/30164 ,  H05K2201/09918

摘要： The present disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool, in particular a drilling station for machining at least one circuit board, as well as to a method for controlling or identifying a platelike workpiece (1). The machining station has at least one X-ray radiation source (3), at least one detector (4) and a table (2) that can be positioned between the X-ray radiation source (3) and the detector (4), on which the workpiece (1) to be machined can be fastened. The table (2) has a receiving plate (6) made out of a material permeable to X-rays (5), in particular a plastic. The receiving plate (6) has at least one suction port (11) for extracting air and a distribution grid, which is connected in terms of flow with the at least one suction port (11) and consists of several channels (10) unilaterally open in a support surface (9) with beveled and/or rounded edges (13) and/or of inclinedly running through openings (14).

公开(公告)号：US11711898B2

公开(公告)日：2023-07-25

申请号：US16782230

申请日：2020-02-05

申请人： GOOGLE LLC

发明人： Douglas Raymond Dykaar

IPC分类号： H05K3/46 ,  H05K3/00 ,  B23K3/08 ,  H05K13/04 ,  B23K101/42

CPC分类号： H05K3/4638 ,  H05K3/0008 ,  B23K3/087 ,  B23K2101/42 ,  H05K13/0465

摘要： There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

公开(公告)号：US20180224815A1

公开(公告)日：2018-08-09

申请号：US15949612

申请日：2018-04-10

申请人： Flextronics AP, LLC

发明人： Raymundo Alatorre Mercado ,  Murad Kurwa ,  Gervasio Mutarelli ,  Xiuchuan Wang

IPC分类号： G05B19/00 ,  B25J15/04 ,  H05K3/00

CPC分类号： G05B19/00 ,  B25J11/00 ,  B25J15/04 ,  H05K3/0005 ,  H05K3/0008

摘要： A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.

公开(公告)号：US20180095371A1

公开(公告)日：2018-04-05

申请号：US15509484

申请日：2016-06-08

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Lei Zhang ,  Wukun Dai ,  Lei Chen ,  Jiapeng Li ,  Yiping Dong

IPC分类号： G03F9/00 ,  G03F7/20 ,  H05K3/00 ,  H05K1/02 ,  H01L21/68

CPC分类号： G03F9/7038 ,  G02F1/1303 ,  G03F7/20 ,  G03F7/70466 ,  G03F9/7069 ,  G03F9/7076 ,  G03F9/7088 ,  H01L21/681 ,  H01L27/1214 ,  H05K1/0269 ,  H05K3/0008

摘要： An overlay alignment detection apparatus for a display device and an exposure process system are provided by embodiments of the present disclosure, the overlay alignment detection apparatus including a bearing frame for bearing the display device, a control device, a detection device and an analysis device. The control device is configured to send control commands to the detection device depending on pre-stored coordinate information of a reference point within an overlay area of the display device when the bearing frame is at an idle time among processes; the detection device is configured to be moved to the overlay area of the display device on the bearing frame according to the control commands sent by the control device, to acquire images of the overlay area, and to send the acquired images to the analysis device; and the analysis device is configured to analyze and process an overlay alignment condition of the display device, with the images sent by the detection device. The overlay alignment detection apparatus provided by the present disclosure may determine the overlay alignment condition of the display device without measuring critical dimensions of the display device; therefore, detection efficiency may be enhanced, such that a comprehensive detection may be implemented on all display devices to be detected and product quality thereof may also be improved.

公开(公告)号：US20180050425A1

公开(公告)日：2018-02-22

申请号：US15800034

申请日：2017-10-31

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Shih-Yen CHEN ,  Tzi-Yi SHIEH ,  Yuh-Sen CHANG ,  Chung-Li LEE

IPC分类号： B23K37/04 ,  B23K3/08 ,  H01L21/67 ,  H01L21/687 ,  H01L23/00 ,  B23K1/00 ,  H05K3/00 ,  H05K3/34

CPC分类号： B23K37/04 ,  B23K1/0016 ,  B23K3/08 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/68742 ,  H01L24/11 ,  H01L24/742 ,  H01L24/95 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13101 ,  H01L2224/81191 ,  H05K3/0008 ,  H05K3/3494 ,  H05K2203/081 ,  H05K2203/087 ,  H01L2924/014 ,  H01L2924/00014

摘要： A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

公开(公告)号：US20170366716A1

公开(公告)日：2017-12-21

申请号：US15619628

申请日：2017-06-12

申请人： MAGNA ELECTRONICS INC.

发明人： Marc-Andre Sigle ,  Achim Newiger ,  Christian Mai ,  Benjamin Peter

IPC分类号： H04N5/225 ,  H05K3/30 ,  H05K3/00 ,  H05K3/34 ,  G06T1/00

CPC分类号： H04N5/2257 ,  G06T1/0007 ,  H01R12/57 ,  H01R24/50 ,  H05K3/0008 ,  H05K3/303 ,  H05K3/341

摘要： A camera for a vehicle vision system includes a front housing portion, a circuit board, and a rear housing portion having a connector portion for connection of a vehicle coaxial cable. The circuit board includes a first solder pad for soldering a core pin connecting element, and a second solder pad that partially circumscribes the first solder pad for soldering a shielding connecting element. The second solder pad only partially circumscribes the first solder pad so as to have a gap between opposing ends of the second solder pad. The gap is configured to allow for escape of gases that evaporate out of the solder during the soldering process. The core pin connecting element electrically connects between a core pin of the connected coaxial cable and circuitry of the circuit board and the shielding connecting element electrically connects between shielding of the coaxial cable and circuitry of the circuit board.

公开(公告)号：US09808891B2

公开(公告)日：2017-11-07

申请号：US14156881

申请日：2014-01-16

申请人： Taiwan Semiconductor Manufacturing CO., LTD.

发明人： Shih-Yen Chen ,  Tzi-Yi Shieh ,  Yuh-Sen Chang ,  Chung-Li Lee

IPC分类号： B23K37/00 ,  H01L21/67 ,  B23K37/04 ,  H01L23/00 ,  B23K1/00 ,  B23K3/08 ,  H01L21/687 ,  H05K3/00 ,  H05K3/34

CPC分类号： B23K37/04 ,  B23K1/0016 ,  B23K3/08 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/68742 ,  H01L24/11 ,  H01L24/742 ,  H01L24/95 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13101 ,  H01L2224/81191 ,  H05K3/0008 ,  H05K3/3494 ,  H05K2203/081 ,  H05K2203/087 ,  H01L2924/014 ,  H01L2924/00014

摘要： A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

公开(公告)号：US20170318680A1

公开(公告)日：2017-11-02

申请号：US15654977

申请日：2017-07-20

申请人： Konrad GmbH

发明人： Michael Konrad ,  Stefan Werner

IPC分类号： H05K3/00

CPC分类号： H05K3/0008 ,  H05K2201/09918 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/53261

摘要： In a device for producing and/or processing a workpiece, in particular circuit boards, in a work station, in particular for printing a corresponding blank or for checking finished circuit boards, at least one mark is provided on the workpiece. In this arrangement, at least one reference, which can be brought into alignment with the mark, is provided in the work station.

公开(公告)号：US09596765B2

公开(公告)日：2017-03-14

申请号：US14426364

申请日：2012-09-11

申请人： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

发明人： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  C25D7/06 ,  H05K1/09 ,  H05K3/40 ,  H01L23/544 ,  H01L21/683 ,  H05K1/02 ,  H01L21/56

CPC分类号： H05K3/0008 ,  C25D7/0607 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/185 ,  H05K1/188 ,  H05K3/305 ,  H05K3/4007 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  H01L2924/00

摘要： A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

摘要翻译： 根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成 在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成 参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。