公开(公告)号：US09138835B2

公开(公告)日：2015-09-22

申请号：US13728402

申请日：2012-12-27

申请人： SEIKO Precision Inc.

发明人： Ikuo Shiozawa ,  Tsutomu Saito ,  Takeshi Tokairin ,  Koji Yoneda

IPC分类号： B23P11/00 ,  H05K3/00

CPC分类号： B23P11/00 ,  H05K3/0008 ,  H05K3/0038 ,  H05K3/0055 ,  H05K2203/0346 ,  Y10T29/51

摘要： The X-ray processing device comprises a work table on which a processing object is placed, X-ray processors irradiating the processing object placed in a given processing zone on the work table with an X-ray for processing, a pressing member, and X-ray shielding sheets. The pressing member presses and collapses any remaining raised edges at the sides of the processing object. The X-ray shielding sheets are provided on the side of the pressing member that is closest to the processing zone and shield the X-ray from the X-ray processors.

摘要翻译： X射线处理装置包括：放置处理对象的工作台，将X射线处理器照射放置在工作台上的给定处理区域中的处理对象的X射线处理对象用X射线进行处理，按压部件和X 射线屏蔽片。 按压构件在处理对象的侧面按压和折叠任何剩余的凸起边缘。 X射线屏蔽片设置在最靠近处理区域的按压构件的一侧，并且从X射线处理器屏蔽X射线。