公开(公告)号：US20220169827A1

公开(公告)日：2022-06-02

申请号：US17441516

申请日：2020-03-27

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Akiko KUBO ,  Tatsushi HAYASHI ,  Yuko KAWAHARA ,  Susumu BABA

IPC: C08K3/36 ,  H05K1/03

Abstract: Provided is a resin material capable of suppressing warpage of a cured product and shortening the baking time. The resin material according to the present invention contains a thermosetting compound that does not have an aromatic ring in a structural portion excluding a thermosetting functional group, has two or more CH3 terminals in a structural portion excluding a thermosetting functional group, and satisfies the following formula (X); and an inorganic filler, the resin material having a content of the inorganic filler of 30 wt % or more in 100 wt % of components excluding a solvent in the resin material: 0.1≤A/(B×C)≤0.6 . . . Expression (X) A: number of CH3 terminals of a structural portion excluding a thermosetting functional group of the thermosetting compound, B: number of thermosetting functional groups of the thermosetting compound, and C: number of carbon atoms of a structural portion excluding a thermosetting functional group of the thermosetting compound.