公开(公告)号：US20220169827A1

公开(公告)日：2022-06-02

申请号：US17441516

申请日：2020-03-27

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Akiko KUBO ,  Tatsushi HAYASHI ,  Yuko KAWAHARA ,  Susumu BABA

IPC: C08K3/36 ,  H05K1/03

Abstract: Provided is a resin material capable of suppressing warpage of a cured product and shortening the baking time. The resin material according to the present invention contains a thermosetting compound that does not have an aromatic ring in a structural portion excluding a thermosetting functional group, has two or more CH3 terminals in a structural portion excluding a thermosetting functional group, and satisfies the following formula (X); and an inorganic filler, the resin material having a content of the inorganic filler of 30 wt % or more in 100 wt % of components excluding a solvent in the resin material: 0.1≤A/(B×C)≤0.6 . . . Expression (X) A: number of CH3 terminals of a structural portion excluding a thermosetting functional group of the thermosetting compound, B: number of thermosetting functional groups of the thermosetting compound, and C: number of carbon atoms of a structural portion excluding a thermosetting functional group of the thermosetting compound.

公开(公告)号：US20200216659A1

公开(公告)日：2020-07-09

申请号：US16623108

申请日：2018-06-21

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Yuko KAWAHARA ,  Keigo OOWASHI ,  Kouji ASHIBA ,  Rui ZHANG ,  Osamu INUI ,  Hiroshi MAENAKA

IPC: C08L63/00 ,  B32B27/18

Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 μm or less, the average particle diameter of the first inorganic particles is 1 μm or more and less than 20 μm, the average major diameter of the second inorganic particles is 2 μm or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.

公开(公告)号：US20210009749A1

公开(公告)日：2021-01-14

申请号：US16979747

申请日：2019-03-15

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Sayaka WAKIOKA ,  Yuta OATARI ,  Kohei TAKEDA ,  Masami SHINDO ,  Takashi SHINJO ,  Yuko KAWAHARA ,  Susumu BABA ,  Tatsushi HAYASHI

IPC: C08G59/40 ,  C08K3/36 ,  C08G73/10 ,  C08G59/24 ,  C09J179/08 ,  C09J163/00 ,  C08K5/3445 ,  H05K1/03 ,  H05K3/46 ,  C09J7/35

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.