公开(公告)号：US10815354B2

公开(公告)日：2020-10-27

申请号：US15323787

申请日：2015-09-30

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Hiromaru Yamamoto ,  Hironori Kobayashi ,  Haruhiko Matsuura

IPC: C08J9/18 ,  C08J9/228 ,  C08J9/16 ,  C08J9/232 ,  C08J9/14

Abstract: Provided is a bead expanded molded article comprising a plurality of resin expanded particles that are fusion-bonded with each other, in which the resin expanded particles mainly include a resin having a glass transition temperature of 180° C. or more.

公开(公告)号：US10947359B2

公开(公告)日：2021-03-16

申请号：US16701369

申请日：2019-12-03

Applicant: SEKISUI PLASTICS CO., LTD.

Inventor： Hiromaru Yamamoto ,  Hironori Kobayashi ,  Haruhiko Matsuura

IPC: C08J9/18 ,  C08J9/16 ,  C08J9/232 ,  C08J9/14 ,  C08J9/228

Abstract: Provided is a bead expanded molded article comprising a plurality of resin expanded particles that are fusion-bonded with each other, in which the resin expanded particles mainly include a resin having a glass transition temperature of 180° C. or more.