Substrate treating apparatus and temperature control method for gas distribution plate

    公开(公告)号:US10957517B2

    公开(公告)日:2021-03-23

    申请号:US16695386

    申请日:2019-11-26

    Abstract: Disclosed is a substrate treating apparatus including a chamber having a process space therein in which a substrate is treated, a substrate support assembly located in the chamber and including a support plate that supports the substrate, a gas supply unit that supplies gas into the chamber, a gas distribution plate that distributes the gas and supplies the gas into the process space, and a temperature control unit that controls temperature of the gas distribution plate. The temperature control unit includes a heating member that heats the gas distribution plate, a cooling member that cools the gas distribution plate, and a control member that controls the heating member and the cooling member, based on a correlation coefficient regarding an interaction of the heating member and the cooling member and a disturbance coefficient regarding an external influence.

    SUBSTRATE TREATING APPARATUS AND TEMPERATURE CONTROL METHOD FOR GAS DISTRIBUTION PLATE

    公开(公告)号:US20200176224A1

    公开(公告)日:2020-06-04

    申请号:US16695386

    申请日:2019-11-26

    Abstract: Disclosed is a substrate treating apparatus including a chamber having a process space therein in which a substrate is treated, a substrate support assembly located in the chamber and including a support plate that supports the substrate, a gas supply unit that supplies gas into the chamber, a gas distribution plate that distributes the gas and supplies the gas into the process space, and a temperature control unit that controls temperature of the gas distribution plate. The temperature control unit includes a heating member that heats the gas distribution plate, a cooling member that cools the gas distribution plate, and a control member that controls the heating member and the cooling member, based on a correlation coefficient regarding an interaction of the heating member and the cooling member and a disturbance coefficient regarding an external influence.

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