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公开(公告)号：US20230118197A1
公开(公告)日：2023-04-20
申请号：US17960394
申请日：2022-10-05
Applicant: SEMES CO., LTD.
Inventor： Cheon Su CHO
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.
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