公开(公告)号：US20220019148A1

公开(公告)日：2022-01-20

申请号：US17380308

申请日：2021-07-20

Applicant: SEMES CO., LTD.

Inventor： Min Jung PARK ,  Jung Yul LEE ,  Choongki MIN ,  Kyungjin SEO

IPC: G03F7/20

Abstract: The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.