公开(公告)号：US20200171626A1

公开(公告)日：2020-06-04

申请号：US16693569

申请日：2019-11-25

Applicant: SEMES CO., LTD.

Inventor： Ki Sang Eum ,  Byoung Ok Kim ,  Jae Hun Jeong ,  Ju Eun Kim ,  Jun Ho Seo ,  Man Kyu Kang

IPC: B25B11/00 ,  H01L21/68 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.

公开(公告)号：US11766765B2

公开(公告)日：2023-09-26

申请号：US16693569

申请日：2019-11-25

Applicant: SEMES CO., LTD.

Inventor： Ki Sang Eum ,  Byoung Ok Kim ,  Jae Hun Jeong ,  Ju Eun Kim ,  Jun Ho Seo ,  Man Kyu Kang

IPC: B25B11/00 ,  H01L21/68 ,  H01L21/687 ,  H01L21/683

CPC classification number: B25B11/005 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/68742 ,  H01L2221/68309

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.