SUBSTRATE TREATING APPARATUS AND DATA CHANGE DETERMINATION METHOD

    公开(公告)号:US20220374772A1

    公开(公告)日:2022-11-24

    申请号:US17746241

    申请日:2022-05-17

    Inventor: Ki-Sung KOO

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes at least one sensor configured to measure a condition of the substrate or the apparatus in a process of the treating of the substrate; a data collecting unit configured to collect in time series data measured by the sensor; and a data processing unit configured to learn the data by the data collecting unit to detect a change in a current data measured by the sensor. The data processing unit comprises a data learning unit configured to learn a data of the past collected by the data collecting unit using a Siamese network; and a data inspecting unit configured to detect whether an issue has occurred in the current data based on the learned data.

    DATA PROCESSING METHOD AND DATA COMPARING METHOD

    公开(公告)号:US20220391406A1

    公开(公告)日:2022-12-08

    申请号:US17829634

    申请日:2022-06-01

    Abstract: The inventive concept provides a method for processing data generated at a substrate treating. The method includes dividing the data according to each process of the substrate treating; and converting the divided data to a same size. In an embodiment, converting the divided data t a same size comprises converting the divided data to the same size using an ID convolution.

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