Substrate processing apparatus and substrate processing method

    公开(公告)号:US10796891B2

    公开(公告)日:2020-10-06

    申请号:US16161180

    申请日:2018-10-16

    Abstract: Disclosed is a substrate processing apparatus including a chamber having a processing space inside, a support unit that supports a substrate in the processing space, a gas supply unit that supplies gas into the processing space, a plasma source that generates plasma from the gas supplied into the processing space, and a detection unit that is provided in a sidewall of the chamber and that measures an impedance change to detect a degree of adsorption of particles on an inner wall of the chamber or a surface of a part that is exposed to the processing space.

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